For the cutting of silicon wafers Photonics Industries offers two series of lasers perfect for this application, the low powered DC and high powered DS series. These two series of lasers are offered in differentiating power levels and multiple wavelengths. For the purpose of wafer cutting, the 355 nm UV wavelength works best as it processes the material with out leaving any residual heat damage. The 1064 nm IR can also be used but it's used for more specialized products.

For more information on a specific model, please choose one that best fits your criteria.

For more information on a laser which is not listed above but is still appropriate for your application please contact Photonics Industries directly.