Photonics Industries offers a better solution to cutting and scribing than using a mechanical diamond tipped device, our DS and DC line of lasers. Unlike traditional techniques for scribing and cutting, using a laser is better for a number of reasons. For one it won't leave any fine particle debris, as you will find with diamond cutting. This is perfect for anyone working in a clean room environment. The DS and DC series is also very capable of cutting wafers thinner than 75 um, something you can't do mechanically.

For more information on a specific model, please choose one that best fits your criteria.

For more information on a laser which is not listed above but is still appropriate for your application please contact Photonics Industries directly.